公开(公告)号：US20240363392A1

公开(公告)日：2024-10-31

申请号：US18765940

申请日：2024-07-08

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Yingdong Luo ,  Mingwei Zhu ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L21/70 ,  H01L21/02 ,  H01L21/027 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/44 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L21/70 ,  H01L21/02104 ,  H01L21/027 ,  H01L21/707 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/00 ,  H01L33/0093 ,  H01L33/44 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a color conversion layer over each of a plurality of light emitting diodes, and a plurality of isolation walls separating adjacent micro-LEDs of the array.

公开(公告)号：US12006442B2

公开(公告)日：2024-06-11

申请号：US16681700

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: B33Y70/00 ,  B24B37/24 ,  C08G18/10 ,  C08G18/24 ,  C08G18/42 ,  C08G18/67 ,  C09D11/102 ,  C09D11/30

CPC classification number: C09D11/102 ,  B24B37/24 ,  B33Y70/00 ,  C08G18/10 ,  C08G18/246 ,  C08G18/4238 ,  C08G18/6755 ,  C09D11/30

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.

公开(公告)号：US11965103B2

公开(公告)日：2024-04-23

申请号：US16996744

申请日：2020-08-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Daihua Zhang ,  Uma Sridhar ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: C09D11/107 ,  B24B37/24 ,  B29C64/112 ,  B29K33/00 ,  B29K509/02 ,  B29L31/00 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  B33Y80/00 ,  C09K3/14

CPC classification number: C09D11/107 ,  B24B37/245 ,  B29C64/112 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  B33Y80/00 ,  C09K3/1409 ,  B29K2033/08 ,  B29K2509/02 ,  B29L2031/736

Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

公开(公告)号：US11942456B2

公开(公告)日：2024-03-26

申请号：US17587524

申请日：2022-01-28

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Yingdong Luo ,  Mingwei Zhu ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/32 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/0075 ,  H01L33/32 ,  H01L33/504 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A method of fabricating a multi-color display includes dispensing a photo-curable fluid over a display having an array of light emitting diodes (micro-LEDs) disposed below a cover layer. The cover has an outer surface with a plurality of recesses, and the photo-curable fluid fills the recesses. The photo-curable fluid includes a color conversion agent. A plurality of LEDs in the array are activated to illuminate and cure the photo-curable fluid to form a color conversion layer in the recesses over the activated LEDs. This layer will convert light from these LEDs to light of a first color. An uncured remainder of the photo-curable fluid is removed. Then the process is repeated with a different photo-curable fluid having a different color conversion agent and a different plurality of LEDs. This forms a second color conversion layer in different plurality of recesses to convert light from these LEDs to light of a second color.

公开(公告)号：US20230219190A1

公开(公告)日：2023-07-13

申请号：US18124529

申请日：2023-03-21

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Mayu Felicia Yamamura ,  Daniel Redfield ,  Rajeev Bajaj ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  B24B37/22 ,  B33Y80/00 ,  B33Y70/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B33Y80/00 ,  B33Y70/00

Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US20230174861A1

公开(公告)日：2023-06-08

申请号：US18070703

申请日：2022-11-29

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Nag Patibandla ,  Gopi Chandran Ramachandran ,  Srinivas Oruganti ,  Saikat Sen ,  Mahesh Kumar Uppada ,  Arunangshu Biswas

IPC: C09K11/88

CPC classification number: C09K11/883 ,  B82Y20/00

Abstract: Methods of making a multilayered semiconductor particle, which may be referred to as a quantum dot, are described. The methods include combining a first zinc-containing compound and a selenium-containing compound to form a ZnSe mixture. The zinc-containing compound and the selenium-containing compound are rapidly combined in less than or about 5 seconds. The methods also include adding a tellurium-containing compound to the ZnSe mixture to form at least one ZnSeTe particle in a ZnSeTe mixture. The methods still further include forming a first shell layer on the ZnSeTe particle and forming a second shell layer on the first shell layer to make the multilayered semiconductor particle. In additional embodiments, the reactant and particle mixtures may be rapidly stirred. The light emitted by the multilayered semiconductor particles may be characterized by an enhanced narrowband emission profile (i.e., sharpness).

公开(公告)号：US20210379726A1

公开(公告)日：2021-12-09

申请号：US16897195

申请日：2020-06-09

Applicant: Applied Materials, Inc

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00

Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US11094530B2

公开(公告)日：2021-08-17

申请号：US16412222

申请日：2019-05-14

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Yingdong Luo ,  Mingwei Zhu ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L21/00 ,  H01L21/02 ,  H01L33/50 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  H01L33/00 ,  H01L21/70

Abstract: A method of fabricating a multi-color display includes dispensing a photo-curable fluid that includes a color conversion agent over a display having a backplane and an array of light emitting diodes electrically integrated with backplane circuitry of the backplane, activating a plurality of light emitting diodes in the array of light emitting diodes to illuminate and cure the first photo-curable fluid to form a color conversion layer over each of the first plurality of light emitting diodes to convert light from the plurality of light emitting diodes to light of a first color, and removing an uncured remainder of the first photo-curable fluid. This process is repeated with a fluid having different color conversion components for another color.

公开(公告)号：US11072050B2

公开(公告)日：2021-07-27

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi Fu ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  Rajeev Bajaj ,  Ashwin Chockalingam ,  Dominic J. Benvegnu ,  Mario Dagio Cornejo ,  Mayu Yamamura ,  Nag B. Patibandla ,  Ankit Vora

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US20210069860A1

公开(公告)日：2021-03-11

申请号：US16681714

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: B24B53/017 ,  B24D3/00 ,  C08L75/06

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.