Invention Grant
- Patent Title: Electronic device package and method of manufacturing the same
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Application No.: US17317762Application Date: 2021-05-11
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Publication No.: US11798859B2Publication Date: 2023-10-24
- Inventor: Chia-Pin Chen , Chia-Sheng Tien , Wan-Ting Chiu , Chi Long Tsai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/498 ; H01L25/18 ; H01L25/065

Abstract:
An electronic device package includes an encapsulated electronic component, a substrate, a conductor and a buffer layer. The encapsulated electronic component includes a redistribution layer (RDL) and an encapsulation layer. The first surface is closer to the RDL than the second surface is. The encapsulation layer includes a first surface, and a second surface opposite to the first surface. The substrate is disposed on the second surface of the encapsulation layer. The conductor is disposed between the substrate and the encapsulated electronic component, and electrically connecting the substrate to the encapsulated electronic component. The buffer layer is disposed between the substrate and the encapsulated electronic component and around the conductor.
Public/Granted literature
- US20220367306A1 ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-11-17
Information query
IPC分类: