Invention Grant
- Patent Title: Bonding apparatus and method of fabricating display device using the same
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Application No.: US17123836Application Date: 2020-12-16
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Publication No.: US11798912B2Publication Date: 2023-10-24
- Inventor: Taeyoung Park , Jungseon Park , Jun-Hee Lee , Hyunwoo Lee
- Applicant: Samsung Display Co., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: KILE PARK REED & HOUTTEMAN PLLC
- Priority: KR 20200037422 2020.03.27
- Main IPC: B32B41/00
- IPC: B32B41/00 ; H01L23/00 ; H05K3/32 ; H10K59/131

Abstract:
A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.
Public/Granted literature
- US20210305201A1 BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME Public/Granted day:2021-09-30
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