公开(公告)号：US11528807B2

公开(公告)日：2022-12-13

申请号：US17147446

申请日：2021-01-12

Applicant: Samsung Display Co., Ltd.

Inventor： Jungseon Park ,  Taeyoung Park ,  Jun-Hee Lee ,  Hyunwoo Lee

IPC: B32B41/00 ,  H05K3/10 ,  H05K3/32

Abstract: A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.

公开(公告)号：US11798912B2

公开(公告)日：2023-10-24

申请号：US17123836

申请日：2020-12-16

Applicant: Samsung Display Co., LTD.

Inventor： Taeyoung Park ,  Jungseon Park ,  Jun-Hee Lee ,  Hyunwoo Lee

IPC: B32B41/00 ,  H01L23/00 ,  H05K3/32 ,  H10K59/131

CPC classification number: H01L24/80 ,  H01L24/74 ,  H01L24/75 ,  H01L24/83 ,  H05K3/323 ,  H05K3/328 ,  H01L2224/75701 ,  H01L2224/75753 ,  H01L2224/75754 ,  H01L2224/75804 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80205 ,  H01L2224/8313 ,  H01L2224/83132 ,  H05K2203/0285 ,  H05K2203/1509 ,  H05K2203/166 ,  H05K2203/167 ,  H10K59/131

Abstract: A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.

公开(公告)号：US20210289632A1

公开(公告)日：2021-09-16

申请号：US17147446

申请日：2021-01-12

Applicant: Samsung Display Co., Ltd

Inventor： JUNGSEON PARK ,  Taeyoung Park ,  Jun-Hee Lee ,  Hyunwoo Lee

IPC: H05K3/10 ,  H05K3/32

Abstract: A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.

公开(公告)号：US12199055B2

公开(公告)日：2025-01-14

申请号：US17116902

申请日：2020-12-09

Applicant: Samsung Display Co., Ltd.

Inventor： Hyunwoo Lee ,  Jungseon Park ,  Taeyoung Park ,  Jun-Hee Lee

IPC: H01L23/00 ,  H05K1/14

Abstract: A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.

公开(公告)号：US20210305183A1

公开(公告)日：2021-09-30

申请号：US17116902

申请日：2020-12-09

Applicant: Samsung Display Co., Ltd.

Inventor： HYUNWOO LEE ,  Jungseon Park ,  Taeyoung Park ,  Jun-Hee Lee

IPC: H01L23/00 ,  H05K1/14

Abstract: A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.

公开(公告)号：US10716221B2

公开(公告)日：2020-07-14

申请号：US15449697

申请日：2017-03-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jun-hee Lee ,  Sang-hoon Back ,  Daeho Yang ,  Seungjoo Lee ,  Myung-gil Choi ,  Taeyoung Park

IPC: H05K3/36 ,  G02F1/1345 ,  H05K1/14 ,  H05K13/00

Abstract: Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.