- 专利标题: Manufacturing method of array substrate
-
申请号: US16965495申请日: 2019-07-22
-
公开(公告)号: US11798959B2公开(公告)日: 2023-10-24
- 发明人: Wei Yang , Guangcai Yuan , Ce Ning , Xinhong Lu , Tianmin Zhou , Lizhong Wang
- 申请人: BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Beijing
- 代理机构: Nath, Goldberg & Meyer
- 代理商 Joshua B. Goldberg
- 国际申请: PCT/CN2019/097131 2019.07.22
- 国际公布: WO2021/012158A 2021.01.28
- 进入国家日期: 2020-07-28
- 主分类号: H01L27/00
- IPC分类号: H01L27/00 ; H01L27/12
摘要:
Provided are an array substrate and a manufacturing method thereof, the manufacturing method includes: forming a first active layer on a base substrate; forming a second active layer; forming a second gate on the second active layer; forming a first insulating layer covering the first active layer on the second gate; patterning the first insulating layer to form first via holes at both sides of the second gate to expose the second active layer; depositing a first metal layer in the first via holes and on the first insulating layer; patterning the first metal layer, removing a part of the first metal layer above the first active layer to expose the first insulating layer; etching the first insulating layer using the patterned first metal layer as a mask, forming second via holes above the first active layer to expose the first active layer; cleaning the exposed first active layer.
公开/授权文献
- US20230163145A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF 公开/授权日:2023-05-25
信息查询
IPC分类: