Invention Grant
- Patent Title: Field-effect transistor
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Application No.: US17705380Application Date: 2022-03-27
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Publication No.: US11799031B2Publication Date: 2023-10-24
- Inventor: Su Xing , Chung Yi Chiu , Hai Biao Yao
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: CN 2010391505.0 2020.05.11
- The original application number of the division: US16907001 2020.06.19
- Main IPC: H01L21/8232
- IPC: H01L21/8232 ; H01L21/762 ; H01L29/749 ; H01L29/786 ; H01L29/66 ; H01L29/06 ; H01L21/225

Abstract:
A structure of field-effect transistor includes a silicon layer of a silicon-on-insulator structure. A gate structure layer in a line shape is disposed on the silicon layer, wherein the gate structure layer includes a first region and a second region abutting to the first region. Trench isolation structures in the silicon layer are disposed at two sides of the gate structure layer, corresponding to the second region. The second region of the gate structure layer is disposed on the silicon layer and overlaps with the trench isolation structure. A source region and a drain region are disposed in the silicon layer at the two sides of the gate structure layer, corresponding to the first region. The second region of the gate structure layer includes a conductive-type junction portion.
Public/Granted literature
- US20220216345A1 FIELD-EFFECT TRANSISTOR Public/Granted day:2022-07-07
Information query
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