Invention Grant
- Patent Title: Method for manufacturing electrochemical device having exposed metal layer outside packaging
-
Application No.: US17315909Application Date: 2021-05-10
-
Publication No.: US11804337B2Publication Date: 2023-10-31
- Inventor: Jung Joon Yoo , Ji Haeng Yu , Kyong Sik Yun , Jeong Hun Baek , Hyeon Jin Kim
- Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
- Applicant Address: KR Daejeon
- Assignee: Korea Institute of Energy Research
- Current Assignee: Korea Institute of Energy Research
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR 20210038787 2021.03.25
- Main IPC: H01G11/84
- IPC: H01G11/84 ; H01G11/24 ; H01G11/10

Abstract:
Disclosed herein is an electrochemical device forming a chip-capacitor or a super-capacitor. The electrochemical device includes: a ceramic substrate having a nonconductive ceramic layer, a current collecting layer disposed on a nonconductive ceramic layer and made of ceramic or cermet, and a metal layer arranged on outer surfaces of the nonconductive ceramic layer and the current collecting layer; an electrode having a positive electrode and a negative electrode and formed on the current collecting layer; and a nonconductive ceramic packaging module located on the ceramic substrate to accommodate electrolyte therein, wherein the metal layer is exposed to the outside of the nonconductive ceramic packaging module.
Public/Granted literature
- US20220310332A1 ELECTROCHEMICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-09-29
Information query