Invention Grant
- Patent Title: Semiconductor package structure and method of manufacturing the same
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Application No.: US17473829Application Date: 2021-09-13
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Publication No.: US11804461B2Publication Date: 2023-10-31
- Inventor: Yu-Ping Tsai , Ming-Chi Liu , Yu-Ting Lu , Kai-Chiang Hsu , Che-Ting Liu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L21/683 ; H01L21/78 ; H01L23/29 ; H01L23/31 ; H01L23/498 ; H01L25/10 ; H01L23/538
Abstract:
A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
Public/Granted literature
- US20210407951A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-12-30
Information query
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