公开(公告)号：US12183712B2

公开(公告)日：2024-12-31

申请号：US18089458

申请日：2022-12-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Che-Ting Liu ,  Jheng-Yu Hong ,  Yu-Ting Lu ,  Po-Chun Lee ,  Chih-Hsiang Hsu

IPC: H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/544

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

公开(公告)号：US11804461B2

公开(公告)日：2023-10-31

申请号：US17473829

申请日：2021-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Ping Tsai ,  Ming-Chi Liu ,  Yu-Ting Lu ,  Kai-Chiang Hsu ,  Che-Ting Liu

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L23/538

CPC classification number: H01L24/24 ,  H01L21/565 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/19 ,  H01L24/25 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68381 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19102 ,  H01L2924/35121

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US11121111B2

公开(公告)日：2021-09-14

申请号：US16565158

申请日：2019-09-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin Tsai ,  Ming-Chi Liu ,  Yu-Ting Lu ,  Kai-Chiang Hsu ,  Che-Ting Liu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US11538787B2

公开(公告)日：2022-12-27

申请号：US17086179

申请日：2020-10-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Che-Ting Liu ,  Jheng-Yu Hong ,  Yu-Ting Lu ,  Po-Chun Lee ,  Chih-Hsiang Hsu

IPC: H01L21/56 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L23/544 ,  H01L21/67

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

公开(公告)号：US11088057B2

公开(公告)日：2021-08-10

申请号：US16409669

申请日：2019-05-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin Tsai ,  Man-Wen Tseng ,  Yu-Ting Lu

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor package structure includes a wiring structure, a semiconductor module, a protection layer and a plurality of outer conductive vias. The wiring structure includes at least one dielectric layer and at least one redistribution layer. The semiconductor module is electrically connected to the wiring structure. The semiconductor module has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The protection layer covers the lateral surface of the semiconductor module and a surface of the wiring structure. The outer conductive vias surround the lateral surface of the semiconductor module, electrically connect to the wiring structure, and extend through a dielectric layer of the wiring structure and the protection layer.

公开(公告)号：US10269771B2

公开(公告)日：2019-04-23

申请号：US15675612

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hao Lyu ,  Chieh-Ju Tsai ,  Yu-Kai Lin ,  Wei-Ming Hsieh ,  Yu-Pin Tsai ,  Man-Wen Tseng ,  Yu-Ting Lu

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/28 ,  H01L23/31 ,  H01L23/427 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.