Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17245601Application Date: 2021-04-30
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Publication No.: US11804530B2Publication Date: 2023-10-31
- Inventor: Munhyeon Kim , Myung Gil Kang , Wandon Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200128176 2020.10.05
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/06 ; H01L29/49 ; H01L29/786

Abstract:
Disclosed are a semiconductor device and a method of fabricating the same. The device may include a substrate, an active pattern in an upper portion of the substrate and is extending in a first direction, a gate electrode crossing the active pattern and extending in a second direction intersecting the first direction, a first gate spacer covering a side surface of the gate electrode, a first inhibition layer between the gate electrode and the first gate spacer, and a gate insulating layer between the gate electrode and the active pattern. The gate insulating layer may include a high-k dielectric layer and a gate oxide layer. The gate oxide layer may be between the high-k dielectric layer and the active pattern. The high-k dielectric layer may be between the gate oxide layer and the gate electrode.
Public/Granted literature
- US20220109057A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-04-07
Information query
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