Invention Grant
- Patent Title: Optoelectronic component, optoelectronic component group in buffer layer opening and production method for same
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Application No.: US16980859Application Date: 2019-04-26
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Publication No.: US11804568B2Publication Date: 2023-10-31
- Inventor: Rainer Hartmann , Clemens Vierheilig , Tobias Meyer , Andreas Rueckerl , Tilman Schimpke , Michael Binder
- Applicant: Osram OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: Osram OLED GmbH
- Current Assignee: Osram OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: VIERING, JENTSCHURA & PARTNER MBB
- Priority: DE 2018110344.1 2018.04.30
- International Application: PCT/EP2019/060759 2019.04.26
- International Announcement: WO2019/211193A 2019.11.07
- Date entered country: 2020-09-15
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/26 ; H01L31/12 ; H01L33/00 ; H01L25/075 ; H01L33/12 ; H01L33/62

Abstract:
Optoelectronic components, groups of optoelectronic components, and methods for producing a component or a plurality of optoelectronic components are provided. The method may include providing a growth substrate having a buffer layer arranged thereon. The buffer layer may be structured in such a way that it has a plurality of the openings which are spaced apart from one another in lateral directions. A plurality of semiconductor bodies may be formed in the openings, wherein in the areas of the openings, the buffer layer has subregions which are arranged in a vertical direction between the growth substrate and the semiconductor bodies. The growth substrate may be detached from the semiconductor bodies. The buffer layer may be removed at least in the areas of the subregions.
Public/Granted literature
- US20210043796A1 COMPONENT, COMPONENT GROUP AND PRODUCTION METHOD FOR SAME Public/Granted day:2021-02-11
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