公开(公告)号：US11804568B2

公开(公告)日：2023-10-31

申请号：US16980859

申请日：2019-04-26

Applicant: Osram OLED GmbH

Inventor： Rainer Hartmann ,  Clemens Vierheilig ,  Tobias Meyer ,  Andreas Rueckerl ,  Tilman Schimpke ,  Michael Binder

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L25/075 ,  H01L33/12 ,  H01L33/62

CPC classification number: H01L33/0093 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/12 ,  H01L33/62

Abstract: Optoelectronic components, groups of optoelectronic components, and methods for producing a component or a plurality of optoelectronic components are provided. The method may include providing a growth substrate having a buffer layer arranged thereon. The buffer layer may be structured in such a way that it has a plurality of the openings which are spaced apart from one another in lateral directions. A plurality of semiconductor bodies may be formed in the openings, wherein in the areas of the openings, the buffer layer has subregions which are arranged in a vertical direction between the growth substrate and the semiconductor bodies. The growth substrate may be detached from the semiconductor bodies. The buffer layer may be removed at least in the areas of the subregions.

公开(公告)号：US10651342B2

公开(公告)日：2020-05-12

申请号：US16315463

申请日：2017-07-11

Applicant: OSRAM OLED GmbH

Inventor： Roland Zeisel ,  Michael Binder ,  Jens Ebbecke ,  Tobias Meyer

IPC: H01L33/22 ,  H01L33/02 ,  H01L33/06

Abstract: An optoelectronic semiconductor chip is disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor body comprising a first semiconductor structure, a second semiconductor structure and an active region between the first and the second semiconductor structure and a plurality of recesses, each penetrating at least one of the semiconductor structures and the active region, wherein a cover surface of the active region is a continuous surface, and wherein at least in some of the recesses, surfaces of the recesses are completely covered with an electrically insulating material.