Invention Grant
- Patent Title: Driver placement in memories having stacked memory arrays
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Application No.: US17145131Application Date: 2021-01-08
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Publication No.: US11805653B2Publication Date: 2023-10-31
- Inventor: Haitao Liu , Kamal M. Karda , Gurtej S. Sandhu , Sanh D. Tang , Akira Goda , Lifang Xu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- The original application number of the division: US16248248 2019.01.15
- Main IPC: H01L27/11573
- IPC: H01L27/11573 ; H10B43/40 ; G11C16/08 ; H01L23/532 ; H01L21/28 ; H10B43/10 ; H10B43/27 ; H10B43/35 ; H10B41/10 ; H10B41/27 ; H10B41/35 ; H10B41/40
Abstract:
A memory can have a stacked memory array that can have a plurality of levels of memory cells. Each respective level of memory cells can be commonly coupled to a respective access line. A plurality of drivers can be above the stacked memory array. Each respective driver can have a monocrystalline semiconductor with a conductive region coupled to a respective access line.
Public/Granted literature
- US20210134825A1 DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS Public/Granted day:2021-05-06
Information query
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