- 专利标题: Semiconductor processing liquid and method for processing substrate
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申请号: US17181352申请日: 2021-02-22
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公开(公告)号: US11807792B2公开(公告)日: 2023-11-07
- 发明人: Takahiro Eto , Lihong Liu
- 申请人: TOKYO OHKA KOGYO CO., LTD.
- 申请人地址: JP Kawasaki
- 专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址: JP Kawasaki
- 代理机构: Knobbe, Martens, Olson & Bear, LLP
- 主分类号: C09K13/04
- IPC分类号: C09K13/04 ; H01L21/306 ; C09K13/06 ; H01L21/3213 ; C09K13/08 ; H01L21/311
摘要:
A semiconductor processing liquid including hydrofluoric acid, and an organic solvent, in which the organic solvent contains a compound represented by the formula below in which X1 is a single bond or an alkylene group having 1 to 6 carbon atoms, in which an ether bond may be interposed, Y10 is one of —O—, —(C═O)—, —O—(C═O)—, and —(C═O)—O—, Y20 is one of —(C═O)—, —O—(C═O)—, and —(C═O)—O—, and Y11 and Y21 are each independently a single bond or an alkylene group having 1 to 6 carbon atoms in which an ether bond may be interposed, provided that, X1, Y11, and Y21 do not contain hydroxyl groups in structures thereof, and when X1 is a single bond, Y10 is not —O—)
H3C—Y11—Y10—X1—Y20—Y21—CH3 (1).
H3C—Y11—Y10—X1—Y20—Y21—CH3 (1).
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