Invention Grant
- Patent Title: Dimension measurement apparatus
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Application No.: US17369196Application Date: 2021-07-07
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Publication No.: US11808560B2Publication Date: 2023-11-07
- Inventor: Yi-Cheng Chen , Yi-Chia Hsu , Chia-Ching Lin , Chih-Chieh Chao
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C
- Priority: TW 9144106 2020.12.14
- Main IPC: G01B11/02
- IPC: G01B11/02 ; G01B5/00 ; G01B5/02

Abstract:
A measuring equipment, applied to carry a workpiece to be measured, includes a main base and a positioning device. The main base includes a measuring center axis. The positioning device includes at least two positioning elements. Each of the at least two positioning elements is disposed movably on the main base, and each of the at least two positioning elements is moved with respect to the measuring center axis. An identical distance is there from each of the at least two positioning elements to the measuring center axis. Each of the at least two positioning elements is used for the workpiece to contact and to be positioned to the measuring center axis.
Public/Granted literature
- US20220187056A1 DIMENSION MEASUREMENT APPARATUS Public/Granted day:2022-06-16
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