Invention Grant
- Patent Title: Structures and methods for high speed interconnection in photonic systems
-
Application No.: US18080684Application Date: 2022-12-13
-
Publication No.: US11808977B2Publication Date: 2023-11-07
- Inventor: Weiwei Song , Stefan Rusu , Mohammed Rabiul Islam
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G02B6/132
- IPC: G02B6/132 ; G02B6/136 ; H04B10/25 ; G02B6/12

Abstract:
Structures and methods for high speed interconnection in photonic systems are described herein. In one embodiment, a photonic device is disclosed. The photonic device includes: a substrate; a plurality of metal layers on the substrate; a photonic material layer comprising graphene over the plurality of metal layers; and an optical routing layer comprising a waveguide on the photonic material layer.
Public/Granted literature
- US20230114059A1 STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC SYSTEMS Public/Granted day:2023-04-13
Information query