公开(公告)号：US12228768B2

公开(公告)日：2025-02-18

申请号：US18063186

申请日：2022-12-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Weiwei Song ,  Chan-Hong Chern ,  Chih-Chang Lin ,  Stefan Rusu ,  Min-Hsiang Hsu

IPC: G02B6/124 ,  B29D11/00 ,  G02B6/122 ,  G02B6/132 ,  G02B6/12

Abstract: Methods of fabricating optical devices with high refractive index materials are disclosed. The method includes forming a first oxide layer on a substrate and forming a patterned template layer with first and second trenches on the first oxide layer. A material of the patterned template layer has a first refractive index. The method further includes forming a first portion of a waveguide and a first portion of an optical coupler within the first and second trenches, respectively, forming a second portion of the waveguide and a second portion of the optical coupler on a top surface of the patterned template layer, and depositing a cladding layer on the second portions of the waveguide and optical coupler. The waveguide and the optical coupler include materials with a second refractive index that is greater than the first refractive index.

公开(公告)号：US20240393537A1

公开(公告)日：2024-11-28

申请号：US18788558

申请日：2024-07-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Weiwei Song ,  Stefan Rusu ,  Chewn-Pu Jou ,  Huan-Neng Chen

IPC: G02B6/293 ,  G02B6/122 ,  G02B6/14 ,  H01S5/30

Abstract: A method includes etching a silicon layer to form a silicon slab and an upper silicon region over the silicon slab, and implanting the silicon slab and the upper silicon region to form a p-type region, an n-type region, and an intrinsic region between the p-type region and the n-type region. The method further includes etching the p-type region, the n-type region, and the intrinsic region to form a trench. The remaining portions of the upper silicon region form a Multi-Mode Interferometer (MMI) region. An epitaxy process is performed to grow a germanium region in the trench. Electrical connections are made to connect to the p-type region and the n-type region.

公开(公告)号：US11899240B2

公开(公告)日：2024-02-13

申请号：US17836879

申请日：2022-06-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Weiwei Song ,  Stefan Rusu

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/122 ,  G06N3/067

CPC classification number: G02B6/12002 ,  G02B6/122 ,  G02B6/13 ,  G02B2006/12061 ,  G06N3/067

Abstract: Photonic device, system and methods of making photonic devices and systems, the method including: providing a substrate, forming an insulator layer over the substrate, depositing a plurality of waveguide layers and a plurality of insulator spacers at different vertical levels over the insulator layer, wherein adjacent waveguide layers in the plurality of waveguide layers are isolated by one or more insulator spacers in the plurality of insulator spacers, and forming a plurality of waveguide patterns at the plurality of waveguide layers, wherein at least two waveguide patterns at different vertical levels in the plurality of waveguide patterns are coupled.

公开(公告)号：US20230305226A1

公开(公告)日：2023-09-28

申请号：US18327415

申请日：2023-06-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Mohammed Rabiul Islam ,  Stefan Rusu ,  Weiwei Song

IPC: G02B6/12 ,  H01L23/00 ,  G02B6/13 ,  H01L25/00

CPC classification number: G02B6/12004 ,  H01L24/16 ,  G02B6/13 ,  H01L25/00 ,  H01L23/5385

Abstract: A structure includes an optical interposer attached to a package substrate, wherein the optical interposer includes a silicon waveguide, a first photonic component optically coupled to the silicon waveguide, a second photonic component optically coupled to the silicon waveguide, and an interconnect structure extending over the silicon waveguide, over the first photonic component, and over the second photonic component, wherein the interconnect structure is electrically connected to the first photonic component and to the second photonic component, a first semiconductor device attached to the interconnect structure, wherein the first semiconductor device is electrically connected to the first photonic component through the interconnect structure, and a second semiconductor device attached to the interconnect structure, wherein the second semiconductor device is electrically connected to the second photonic component through the interconnect structure.

公开(公告)号：US11703639B2

公开(公告)日：2023-07-18

申请号：US17567349

申请日：2022-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Mohammed Rabiul Islam ,  Stefan Rusu ,  Weiwei Song

IPC: G02B6/12 ,  G02B6/13 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48

CPC classification number: G02B6/12004 ,  G02B6/13 ,  H01L24/16 ,  H01L25/00 ,  G02B2006/12107 ,  G02B2006/12142 ,  H01L21/486 ,  H01L23/5385 ,  H01L2224/16227

Abstract: A structure includes an optical interposer attached to a package substrate, wherein the optical interposer includes a silicon waveguide, a first photonic component optically coupled to the silicon waveguide, a second photonic component optically coupled to the silicon waveguide, and an interconnect structure extending over the silicon waveguide, over the first photonic component, and over the second photonic component, wherein the interconnect structure is electrically connected to the first photonic component and to the second photonic component, a first semiconductor device attached to the interconnect structure, wherein the first semiconductor device is electrically connected to the first photonic component through the interconnect structure, and a second semiconductor device attached to the interconnect structure, wherein the second semiconductor device is electrically connected to the second photonic component through the interconnect structure.

公开(公告)号：US11215753B2

公开(公告)日：2022-01-04

申请号：US16803153

申请日：2020-02-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Mohammed Rabiul Islam ,  Stefan Rusu ,  Weiwei Song

IPC: G02B6/12 ,  H01L23/00 ,  G02B6/13 ,  H01L25/00 ,  H01L23/538 ,  H01L21/48

Abstract: A structure includes an optical interposer attached to a package substrate, wherein the optical interposer includes a silicon waveguide, a first photonic component optically coupled to the silicon waveguide, a second photonic component optically coupled to the silicon waveguide, and an interconnect structure extending over the silicon waveguide, over the first photonic component, and over the second photonic component, wherein the interconnect structure is electrically connected to the first photonic component and to the second photonic component, a first semiconductor device attached to the interconnect structure, wherein the first semiconductor device is electrically connected to the first photonic component through the interconnect structure, and a second semiconductor device attached to the interconnect structure, wherein the second semiconductor device is electrically connected to the second photonic component through the interconnect structure.

公开(公告)号：US11094682B2

公开(公告)日：2021-08-17

申请号：US16744194

申请日：2020-01-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Rabiul Islam ,  Chuei-Tang Wang ,  Stefan Rusu ,  Weiwei Song

IPC: H01L23/31 ,  H01L21/56 ,  G02B6/12 ,  H01L25/16 ,  H01L23/367 ,  H01L23/00

Abstract: A package structure includes a package component, a stacked die package, a plurality of optical fibers and a heat spreading structure. The stacked die package is disposed on and electrically connected to the package component. The stacked die package includes a first semiconductor die and a plurality of second semiconductor dies. The first semiconductor die has a plurality of first bonding elements. The second semiconductor dies are disposed on the first semiconductor die and have a plurality of second bonding elements, wherein the plurality of first bonding elements and the plurality of second bonding elements are facing one another and bonded together through hybrid bonding. The plurality of optical fibers is attached to the plurality of second semiconductor dies of the stacked die package. The heat spreading structure is disposed on the package component and surrounding the stacked die package.

公开(公告)号：US20210225824A1

公开(公告)日：2021-07-22

申请号：US16744194

申请日：2020-01-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Rabiul Islam ,  Chuei-Tang Wang ,  Stefan Rusu ,  Weiwei Song

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  G02B6/12

Abstract: A package structure includes a package component, a stacked die package, a plurality of optical fibers and a heat spreading structure. The stacked die package is disposed on and electrically connected to the package component. The stacked die package includes a first semiconductor die and a plurality of second semiconductor dies. The first semiconductor die has a plurality of first bonding elements. The second semiconductor dies are disposed on the first semiconductor die and have a plurality of second bonding elements, wherein the plurality of first bonding elements and the plurality of second bonding elements are facing one another and bonded together through hybrid bonding. The plurality of optical fibers is attached to the plurality of second semiconductor dies of the stacked die package. The heat spreading structure is disposed on the package component and surrounding the stacked die package.

公开(公告)号：US12092862B2

公开(公告)日：2024-09-17

申请号：US18327415

申请日：2023-06-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Mohammed Rabiul Islam ,  Stefan Rusu ,  Weiwei Song

IPC: G02B6/12 ,  G02B6/13 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L23/538

CPC classification number: G02B6/12004 ,  G02B6/13 ,  H01L24/16 ,  H01L25/00 ,  G02B2006/12107 ,  G02B2006/12142 ,  H01L21/486 ,  H01L23/5385 ,  H01L2224/16227

Abstract: A structure includes an optical interposer attached to a package substrate, wherein the optical interposer includes a silicon waveguide, a first photonic component optically coupled to the silicon waveguide, a second photonic component optically coupled to the silicon waveguide, and an interconnect structure extending over the silicon waveguide, over the first photonic component, and over the second photonic component, wherein the interconnect structure is electrically connected to the first photonic component and to the second photonic component, a first semiconductor device attached to the interconnect structure, wherein the first semiconductor device is electrically connected to the first photonic component through the interconnect structure, and a second semiconductor device attached to the interconnect structure, wherein the second semiconductor device is electrically connected to the second photonic component through the interconnect structure.

公开(公告)号：US11860421B2

公开(公告)日：2024-01-02

申请号：US17097270

申请日：2020-11-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Weiwei Song ,  Chan-Hong Chern ,  Chewn-Pu Jou ,  Stefan Rusu ,  Min-Hsiang Hsu

IPC: G02B6/30 ,  G02B6/26

CPC classification number: G02B6/305 ,  G02B6/262 ,  G02B6/30

Abstract: An optical system with different optical coupling device configurations and a method of fabricating the same are disclosed. An optical system includes a substrate, a waveguide disposed on the substrate, an optical fiber optically coupled to the waveguide, and an optical coupling device disposed between the optical fiber and the waveguide. The optical coupling device configured to optically couple the optical fiber to the waveguide. The optical coupling device includes a dielectric layer disposed on the substrate, a semiconductor tapered structure disposed in a first horizontal plane within the dielectric layer, and a multi-tip dielectric structure disposed in a second horizontal plane within the dielectric layer. The first and second horizontal planes are different from each other.