- 专利标题： High power module package structures
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申请号： US17443307申请日： 2021-07-23
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公开(公告)号： US11810775B2公开(公告)日： 2023-11-07
- 发明人: Yusheng Lin , Jerome Teysseyre
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 代理机构： Brake Hughes Bellermann LLP
- 分案原申请号： US16243505 2019.01.09
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L21/52 ; H01L23/31 ; H01L23/433 ; H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L25/07 ; H01L25/00 ; H01L29/739 ; H01L29/861 ; H01L23/051 ; H01L25/18 ; H01L23/538 ; H01L21/48 ; H01L23/495
摘要：
A method includes disposing a semiconductor die between a first high voltage isolation carrier and a second high voltage isolation carrier, disposing a first molding material in a space between the semiconductor die and the first high voltage isolation carrier, and disposing a conductive spacer between the semiconductor die and the second high voltage isolation carrier. The method further includes encapsulating the first molding material and the conductive spacer with a second molding material.
公开/授权文献
- US20210351101A1 HIGH POWER MODULE PACKAGE STRUCTURES 公开/授权日：2021-11-11
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