A system configured to inspect a processing apparatus includes a temperature adjusting device configured to adjust a temperature of a component within a processing chamber of the processing apparatus; a light source configured to emit measurement light; multiple optical elements configured to output the measurement light emitted from the light source to the component within the processing chamber of the processing apparatus as output light and configured to receive reflected light from the component during a temperature adjustment of the component by the temperature adjusting device; and a controller configured to measure temperatures of the component at measurement points respectively corresponding to the multiple optical elements based on the reflected light, and make a determination upon abnormality of the processing apparatus based on comparisons of the temperatures of the component at the respective measurement points.