Invention Grant
- Patent Title: Atomic layer deposition of rhenium containing thin films
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Application No.: US17448586Application Date: 2021-09-23
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Publication No.: US11821084B2Publication Date: 2023-11-21
- Inventor: Jani Hamalainen , Mikko Ritala , Markku Leskela
- Applicant: ASM IP HOLDING B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding, B.V.
- Current Assignee: ASM IP Holding, B.V.
- Current Assignee Address: NL Almere
- Agency: Banner & Witcoff, Ltd.
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/08 ; C23C16/30 ; C23C16/06 ; C23C16/34

Abstract:
Methods for depositing rhenium-containing thin films are provided. In some embodiments metallic rhenium-containing thin films are deposited. In some embodiments rhenium sulfide thin films are deposited. In some embodiments films comprising rhenium nitride are deposited. The rhenium-containing thin films may be deposited by cyclic vapor deposition processes, for example using rhenium halide precursors. The rhenium-containing thin films may find use, for example, as 2D materials.
Public/Granted literature
- US20220002868A1 ATOMIC LAYER DEPOSITION OF RHENIUM CONTAINING THIN FILMS Public/Granted day:2022-01-06
Information query
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