Invention Grant
- Patent Title: Temperature control loop for integrated circuit
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Application No.: US17387376Application Date: 2021-07-28
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Publication No.: US11822399B2Publication Date: 2023-11-21
- Inventor: Doron Rajwan , Tal Kuzi , Keith Cox , Yizhang Yang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Agent Erik A. Heter; Dean M. Munyon
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F11/30 ; G06F1/08

Abstract:
A temperature control apparatus is disclosed. An integrated circuit (IC) includes a plurality of temperature sensors, a first thermal control loop, and a second thermal control loop. The first thermal control loop is configured to control temperature of the IC by reducing a frequency of a clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a first temperature threshold. The second thermal control loop is configured to control temperature of the IC by dithering the clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a second temperature threshold that is greater than the first temperature threshold.
Public/Granted literature
- US20230031415A1 Temperature Control Loop for Integrated Circuit Public/Granted day:2023-02-02
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