- 专利标题: Inter-board connection structure and power conversion apparatus
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申请号: US17690712申请日: 2022-03-09
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公开(公告)号: US11824301B2公开(公告)日: 2023-11-21
- 发明人: Kiyokatsu Akimoto , Shuzo Isoda , Yasutoki Manda
- 申请人: Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址: JP Osaka
- 专利权人: Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人: Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Seed IP Law Group LLP
- 优先权: JP 21040235 2021.03.12
- 主分类号: H01R13/533
- IPC分类号: H01R13/533 ; H01R12/73
摘要:
Provided is an inter-board connection structure including: a first connector provided to the first board; a second connector provided to the second board, the second connector electrically connecting between the first board and the second board; and a vibration suppressor provided on a side of a surface opposite to a first surface where the second connector is placed, the surface opposite to the first surface being referred to as a second surface, the vibration suppressor supporting the second board from the side of the second surface to suppress vibration generated between the first board and the second board.
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