Invention Grant
- Patent Title: Systems and methods for implementing a scalable system
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Application No.: US17678962Application Date: 2022-02-23
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Publication No.: US11831312B2Publication Date: 2023-11-28
- Inventor: Sanjay Dabral , Bahattin Kilic , Jie-Hua Zhao , Kunzhong Hu , Suk-Kyu Ryu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H03K19/1776
- IPC: H03K19/1776 ; G06F15/78 ; H01L23/31 ; H05K1/02
Abstract:
Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
Public/Granted literature
- US20220231687A1 SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM Public/Granted day:2022-07-21
Information query
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