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公开(公告)号：US20250046674A1
公开(公告)日：2025-02-06
申请号：US18365062
申请日：2023-08-03
Applicant: Apple Inc.
Inventor： Suk-Kyu Ryu , Wei Hu , Jie-Hua Zhao , Myung Jin Yim
IPC: H01L23/42 , H01L23/00 , H01L23/367
Abstract: A module comprising: a module substrate; a system-on-chip die coupled to the module substrate; a thermal interface material layer coupled to the system-on-chip die; a stiffener structure positioned around the system-on-chip die and coupled to the module substrate; and a lid having a first portion coupled to the thermal interface material layer, a second portion coupled to the stiffener structure and a recessed region formed around the first portion and having a reduced thickness relative to the first portion and the second portion.
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公开(公告)号：US20190319626A1
公开(公告)日：2019-10-17
申请号：US16266604
申请日：2019-02-04
Applicant: Apple Inc.
Inventor： Sanjay Dabral , Bahattin Kilic , Jie-Hua Zhao , Kunzhong Hu , Suk-Kyu Ryu
IPC: H03K19/177 , H05K1/02 , H01L23/31 , G06F15/78
Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
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公开(公告)号：US09656856B2
公开(公告)日：2017-05-23
申请号：US15226824
申请日：2016-08-02
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
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公开(公告)号：US09633953B2
公开(公告)日：2017-04-25
申请号：US14518887
申请日：2014-10-20
Applicant: Apple Inc.
Inventor： Jun Chung Hsu , Jie-Hua Zhao
IPC: H01L23/48 , H01L23/00 , H01L23/498 , H01L23/31
CPC classification number: H01L23/562 , H01L23/3128 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L2224/16225 , H01L2924/15311 , H01L2924/18161
Abstract: A methodology for addressing package warpage is described. In an embodiment a package includes a die mounted on a wiring board. Portion of a metal plane within the wiring board includes a reduced portion, characterized by a reduced thickness that is less than a baseline thickness.
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5.发明授权公开(公告)号：US12249599B2
公开(公告)日：2025-03-11
申请号：US18194236
申请日：2023-03-31
Applicant: Apple Inc.
Inventor： Wei Chen , Jie-Hua Zhao , Jun Zhai , Po-Hao Chang , Hsien-Che Lin , Ying-Chieh Ke , Kunzhong Hu
Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
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Patent Agency Ranking
公开(公告)号：US20230062454A1
公开(公告)日：2023-03-02
申请号：US17461207
申请日：2021-08-30
Applicant: Apple Inc.
Inventor： Wei Chen , Jie-Hua Zhao , Jun Zhai
IPC: H01L23/053 , H01L23/10
Abstract: Modules and methods of assembly are described. A module includes a lid mounted on a module substrate and covering a component. A stiffener structure may optionally be mounted between the lid and module substrate. A recess can be formed in any of an outer wall bottom surface of the lid, and top or bottom surface of the stiffener structure such that an adhesive layer at least partially fills the recess.
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公开(公告)号：US11309895B2
公开(公告)日：2022-04-19
申请号：US16911902
申请日：2020-06-25
Applicant: Apple Inc.
Inventor： Sanjay Dabral , Bahattin Kilic , Jie-Hua Zhao , Kunzhong Hu , Suk-Kyu Ryu
IPC: H03K19/1776 , G06F15/78 , H01L23/31 , H05K1/02
Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
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公开(公告)号：US20160340175A1
公开(公告)日：2016-11-24
申请号：US15226824
申请日：2016-08-02
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
Abstract translation: 描述了MEMS封装，模块和制造方法。 在一个实施例中，MEMS封装包括安装在表面安装基板的正面上的MEMS管芯和IC管芯，以及在表面安装基板的前侧封装IC管芯和MEMS管芯的模塑料。 在一个实施例中，在表面安装基板的背侧上的着陆焊盘布置形成并固定平面区域，用于将表面安装基板粘合到不直接在MEMS管芯下方的模块基板。
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9.发明公开公开(公告)号：US20230317708A1
公开(公告)日：2023-10-05
申请号：US18194236
申请日：2023-03-31
Applicant: Apple Inc.
Inventor： Wei Chen , Jie-Hua Zhao , Jun Zhai , Po-Hao Chang , Hsien-Che Lin , Ying-Chieh Ke , Kunzhong Hu
Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
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公开(公告)号：US10742217B2
公开(公告)日：2020-08-11
申请号：US16266604
申请日：2019-02-04
Applicant: Apple Inc.
Inventor： Sanjay Dabral , Bahattin Kilic , Jie-Hua Zhao , Kunzhong Hu , Suk-Kyu Ryu
IPC: H03K19/1776 , G06F15/78 , H01L23/31 , H05K1/02
Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
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