Invention Grant
- Patent Title: Laminate for molding
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Application No.: US17264021Application Date: 2019-08-05
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Publication No.: US11833792B2Publication Date: 2023-12-05
- Inventor: Yasutaka Fukunaga , Fumiaki Kakeya
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 18149542 2018.08.08
- International Application: PCT/JP2019/030746 2019.08.05
- International Announcement: WO2020/031968A 2020.02.13
- Date entered country: 2021-01-28
- Main IPC: B32B33/00
- IPC: B32B33/00 ; C09D7/61 ; C09D7/40 ; B32B7/12 ; B32B27/08 ; B32B27/28 ; B32B27/32 ; C09D133/08 ; C09D7/47 ; C09D7/06

Abstract:
The problem addressed by this invention is to provide a laminate for molding having excellent moldability and post-curing properties of the hard-coat layer, and which can maintain the surface of the hard-coat layer in a satisfactory state while uncured. This problem is solved by a laminate for molding containing a hard-coat layer and a masking film affixed to the surface of the hard-coat layer, having an adhesive surface, which is the hard-coat layer-side surface of the masking film, with a surface free energy of at least 30.0 (mN/m) measured in accordance with the OWRK method, before being affixed. The hard-coat layer is in an uncured state.
Public/Granted literature
- US20210316542A1 LAMINATE FOR MOLDING Public/Granted day:2021-10-14
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