Invention Grant
- Patent Title: RRAM devices and methods of forming RRAM devices
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Application No.: US16840471Application Date: 2020-04-06
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Publication No.: US11839166B2Publication Date: 2023-12-05
- Inventor: Xinshu Cai , Shyue Seng Tan , Eng Huat Toh
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: VIERING JENTSCHURA & PARTNER MBB
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H10B63/00

Abstract:
A resistive random access memory (RRAM) device may be provided, including: a base layer, a vertical electrode stack arranged over the base layer, where the vertical electrode stack may include alternating mask elements and first electrodes, and each first electrode may include an extended portion extending beyond at least one side surface of at least one mask element adjoining the first electrode, a switching layer arranged along the extended portion of each first electrode and along the at least one side surface of the at least one mask element adjoining the first electrode, and a second electrode including a surface in contact with the switching layer. The RRAM device may have a 3D structure.
Public/Granted literature
- US20210313512A1 RRAM DEVICES AND METHODS OF FORMING RRAM DEVICES Public/Granted day:2021-10-07
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