Invention Grant
- Patent Title: Semiconductor package structure and fabrication method thereof
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Application No.: US17700956Application Date: 2022-03-22
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Publication No.: US11842941B2Publication Date: 2023-12-12
- Inventor: Youngho Kim , Hwanpil Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20150123166 2015.08.31 KR 20160106744 2016.08.23
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/367 ; H01L23/373 ; H01L23/40 ; H01L23/492 ; H01L23/00 ; H01L25/10 ; H01L23/498 ; H01L23/538
Abstract:
A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.
Public/Granted literature
- US20220216121A1 SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2022-07-07
Information query
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