Invention Grant
- Patent Title: Methods for transfer of micro-devices
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Application No.: US17670374Application Date: 2022-02-11
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Publication No.: US11843025B2Publication Date: 2023-12-12
- Inventor: Mingwei Zhu , Sivapackia Ganapathiappan , Boyi Fu , Hou T. Ng , Nag B. Patibandla
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- The original application number of the division: US16908462 2020.06.22
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/66 ; H01L27/15 ; H01L33/00 ; H01L23/00 ; H01L33/48 ; H01L25/075
Abstract:
An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.
Public/Granted literature
- US20220165789A1 METHODS FOR TRANSFER OF MICRO-DEVICES Public/Granted day:2022-05-26
Information query
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