公开(公告)号：US11072050B2

公开(公告)日：2021-07-27

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi Fu ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  Rajeev Bajaj ,  Ashwin Chockalingam ,  Dominic J. Benvegnu ,  Mario Dagio Cornejo ,  Mayu Yamamura ,  Nag B. Patibandla ,  Ankit Vora

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US10032827B2

公开(公告)日：2018-07-24

申请号：US15270763

申请日：2016-09-20

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L21/677 ,  H01L21/683 ,  H01L27/15 ,  H01L33/48 ,  H01L23/00 ,  H01L21/66

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

公开(公告)号：US11685014B2

公开(公告)日：2023-06-27

申请号：US16529884

申请日：2019-08-02

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Ankit Vora ,  Boyi Fu ,  Venkat Hariharan ,  Mayu Yamamura ,  Mario Cornejo ,  Igor Abramson ,  Mo Yang ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B29L31/00 ,  B33Y80/00

CPC classification number: B24B37/24 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/10 ,  C08F283/008 ,  B29L2031/736 ,  B33Y80/00

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US11471999B2

公开(公告)日：2022-10-18

申请号：US16042016

申请日：2018-07-23

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24D11/04 ,  B24B37/26 ,  B24D18/00 ,  B24B37/16 ,  B24B37/20 ,  B33Y80/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y30/00 ,  H01L21/306

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US20220165789A1

公开(公告)日：2022-05-26

申请号：US17670374

申请日：2022-02-11

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L27/15 ,  H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L21/66 ,  H01L33/48

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate

公开(公告)号：US20210013258A1

公开(公告)日：2021-01-14

申请号：US16908462

申请日：2020-06-22

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L27/15 ,  H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L21/66 ,  H01L33/48

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate

公开(公告)号：US11980992B2

公开(公告)日：2024-05-14

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24B37/16 ,  B24B37/20 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/306

CPC classification number: B24B37/245 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y80/00 ,  B24B37/16 ,  B24B37/20 ,  B24D2203/00 ,  B33Y30/00 ,  H01L21/30625

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US11826876B2

公开(公告)日：2023-11-28

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Ankit Vora ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B24B37/22 ,  B24B37/24 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B24B37/26 ,  B24B7/22 ,  B22F10/14 ,  B33Y80/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58

CPC classification number: B24B7/22 ,  B22F10/14 ,  B24B37/24 ,  B24B37/26 ,  B29C64/112 ,  B33Y70/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58 ,  B33Y10/00 ,  B33Y80/00 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/10

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

公开(公告)号：US11745302B2

公开(公告)日：2023-09-05

申请号：US17209137

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24 ,  B33Y70/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00 ,  C09G1/16 ,  B33Y70/10 ,  B29K33/04 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D11/00 ,  B24D11/04 ,  B29C35/08 ,  C09D4/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B29C35/0805 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16 ,  B24D2203/00 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y70/10

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US11251226B2

公开(公告)日：2022-02-15

申请号：US16908462

申请日：2020-06-22

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L21/683 ,  H01L21/66 ,  H01L27/15 ,  H01L33/00 ,  H01L23/00 ,  H01L33/48 ,  H01L25/075

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.