Invention Grant
- Patent Title: Nitride capping layer for spin torque transfer (STT) magnetoresistive random access memory (MRAM)
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Application No.: US17873428Application Date: 2022-07-26
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Publication No.: US11849646B2Publication Date: 2023-12-19
- Inventor: Jodi Mari Iwata , Guenole Jan , Ru-Ying Tong , Vignesh Sundar , Jian Zhu , Huanlong Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H10N50/10
- IPC: H10N50/10 ; H10N50/01 ; H10N50/80 ; H10N50/85 ; H01F10/32 ; H01F41/30 ; G11C11/16

Abstract:
A magnetic tunnel junction (MTJ) is disclosed wherein first and second interfaces of a free layer (FL) with a first metal oxide (Hk enhancing layer) and second metal oxide (tunnel barrier), respectively, produce perpendicular magnetic anisotropy (PMA) to increase thermal stability. In some embodiments, a capping layer that is a conductive metal nitride such as MoN contacts an opposite surface of the Hk enhancing layer with respect to the first interface to reduce interdiffusion of oxygen and nitrogen compared with a TiN capping layer and maintain an acceptable resistance×area (RA) product. In other embodiments, the capping layer may comprise an insulating nitride such as AlN that is alloyed with a conductive metal to minimize RA. Furthermore, a metallic buffer layer may be inserted between the capping layer and Hk enhancing layer. As a result, electrical shorts are reduced and the magnetoresistive ratio is increased.
Public/Granted literature
- US20220384716A1 Nitride Capping Layer For Spin Torque Transfer (STT) Magnetoresistive Random Access Memory (MRAM) Public/Granted day:2022-12-01
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