Invention Grant
- Patent Title: Photonic devices integrated with reflectors
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Application No.: US17454063Application Date: 2021-11-09
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Publication No.: US11852867B2Publication Date: 2023-12-26
- Inventor: Yusheng Bian , Bo Peng , Michal Rakowski
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GlobalFoundries U.S. Inc.
- Current Assignee: GlobalFoundries U.S. Inc.
- Current Assignee Address: US NY Malta
- Agent David Cain
- The original application number of the division: US16817582 2020.03.12
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/12

Abstract:
The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.
Public/Granted literature
- US20220057576A1 PHOTONIC DEVICES INTEGRATED WITH REFLECTORS Public/Granted day:2022-02-24
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