Invention Grant
- Patent Title: Metal source/drain features
-
Application No.: US17811193Application Date: 2022-07-07
-
Publication No.: US11854791B2Publication Date: 2023-12-26
- Inventor: Pei-Yu Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- The original application number of the division: US16836320 2020.03.31
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L21/02 ; H01L21/285 ; H01L21/311 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
A semiconductor device according to the present disclosure includes a vertical stack of channel members, a gate structure over and around the vertical stack of channel members, and a first source/drain feature and a second source/drain feature. Each of the vertical stack of channel members extends along a first direction between the first source/drain feature and the second source/drain feature. Each of the vertical stack of channel members is spaced apart from the first source/drain feature by a silicide feature.
Public/Granted literature
- US20220352339A1 Metal Source/Drain Features Public/Granted day:2022-11-03
Information query
IPC分类: