- 专利标题： Integrated circuit package supports
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申请号： US17677105申请日： 2022-02-22
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公开(公告)号： US11854834B2公开(公告)日： 2023-12-26
- 发明人: Kristof Kuwawi Darmawikarta , Robert May , Sri Ranga Sai Boyapati , Srinivas V. Pietambaram , Chung Kwang Christopher Tan , Aleksandar Aleksov
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Akona IP
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/498
摘要：
Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a non-photoimageable dielectric, and a conductive via through the non-photoimageable dielectric, wherein the conductive via has a diameter that is less than 20 microns. Other embodiments are also disclosed.
公开/授权文献
- US20220181166A1 INTEGRATED CIRCUIT PACKAGE SUPPORTS 公开/授权日：2022-06-09
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