Invention Grant
- Patent Title: Wafer positioning method and apparatus
-
Application No.: US17199980Application Date: 2021-03-12
-
Publication No.: US11854853B2Publication Date: 2023-12-26
- Inventor: Chia-Cheng Chen , Chih-Kai Yang , Liang-Yin Chen , Huicheng Chang , Yee-Chia Yeo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L23/544 ; G06T7/73 ; G06T1/00 ; G06T7/00

Abstract:
A method of correcting a misalignment of a wafer on a wafer holder and an apparatus for performing the same are disclosed. In an embodiment, a semiconductor alignment apparatus includes a wafer stage; a wafer holder over the wafer stage; a first position detector configured to detect an alignment of a wafer over the wafer holder in a first direction; a second position detector configured to detect an alignment of the wafer over the wafer holder in a second direction; and a rotational detector configured to detect a rotational alignment of the wafer over the wafer holder.
Public/Granted literature
- US20220293448A1 Wafer Positioning Method and Apparatus Public/Granted day:2022-09-15
Information query
IPC分类: