Invention Grant
- Patent Title: Radio-frequency device comprising semiconductor device and waveguide component
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Application No.: US17248262Application Date: 2021-01-15
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Publication No.: US11854917B2Publication Date: 2023-12-26
- Inventor: Ernst Seler , Ulrich Moeller , Bernhard Rieder
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Priority: DE 2020101293.4 2020.01.21
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/66 ; H01L23/053 ; H01L23/498 ; H01L23/24 ; H01L21/48 ; H01Q9/04

Abstract:
A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.
Public/Granted literature
- US20210225719A1 RADIO-FREQUENCY DEVICE COMPRISING SEMICONDUCTOR DEVICE AND WAVEGUIDE COMPONENT Public/Granted day:2021-07-22
Information query
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