公开(公告)号：US11824019B2

公开(公告)日：2023-11-21

申请号：US17356831

申请日：2021-06-24

Applicant: Infineon Technologies AG

Inventor： Tuncay Erdoel ,  Walter Hartner ,  Ulrich Moeller ,  Bernhard Rieder ,  Ernst Seler ,  Maciej Wojnowski

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01P3/12 ,  G01S13/02

CPC classification number: H01L23/66 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01P3/121 ,  H01Q1/2283 ,  G01S13/02 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

公开(公告)号：US11791529B2

公开(公告)日：2023-10-17

申请号：US17444864

申请日：2021-08-11

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Bernhard Rieder

IPC: H01P3/12 ,  H01Q1/50 ,  H05K1/02

CPC classification number: H01P3/121 ,  H01Q1/50 ,  H05K1/028 ,  H05K1/0243 ,  H05K2201/10098

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity.

公开(公告)号：US20210359387A1

公开(公告)日：2021-11-18

申请号：US17302468

申请日：2021-05-04

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Bernhard Rieder

IPC: H01P5/107 ,  H01L23/66 ,  H01P5/02

Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.

公开(公告)号：US12040543B2

公开(公告)日：2024-07-16

申请号：US17648730

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Tuncay Erdoel ,  Klaus Elian ,  Christian Geissler ,  Bernhard Rieder ,  Rainer Markus Schaller ,  Horst Theuss ,  Maciej Wojnowski

IPC: H01Q13/06 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q23/00

CPC classification number: H01Q13/06 ,  H01Q1/2283 ,  H01Q1/526 ,  H01Q23/00

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

公开(公告)号：US11764453B2

公开(公告)日：2023-09-19

申请号：US17302468

申请日：2021-05-04

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Bernhard Rieder

IPC: H01P5/107 ,  H01P5/02 ,  H01L23/66

CPC classification number: H01P5/107 ,  H01L23/66 ,  H01P5/02 ,  H01L2223/6627

Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.

公开(公告)号：US20240425363A1

公开(公告)日：2024-12-26

申请号：US18732102

申请日：2024-06-03

Applicant: Infineon Technologies AG

Inventor： Bernhard Rieder

IPC: B81B7/02 ,  B81B7/00 ,  G01L19/00 ,  G01L19/14 ,  H04R19/04

Abstract: A package includes a substrate having a first surface and an opposing second surface, a first cavity adjacent to the first surface of the substrate within the package, and a second cavity adjacent to the second surface of the substrate within the package, wherein the second cavity includes a fluid opening for allowing a fluid to enter the second cavity; a through hole in the substrate providing fluid communication between the first and second cavities; a MEMS sound transducer disposed in one of the first cavity or the second cavity; a MEMS pressure sensor disposed in the other one of the first cavity or the second cavity; and a discrete transfer block arranged on the substrate and configured to provide an electric path between the package pad and the MEMS sound transducer and the MEMS pressure sensor, wherein the transfer block is a discrete component separate from the substrate.

公开(公告)号：US11854917B2

公开(公告)日：2023-12-26

申请号：US17248262

申请日：2021-01-15

Applicant: Infineon Technologies AG

Inventor： Ernst Seler ,  Ulrich Moeller ,  Bernhard Rieder

IPC: H01L23/10 ,  H01L23/66 ,  H01L23/053 ,  H01L23/498 ,  H01L23/24 ,  H01L21/48 ,  H01Q9/04

CPC classification number: H01L23/10 ,  H01L21/4803 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/24 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/66 ,  H01Q9/0407 ,  H01L2223/6677

Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

公开(公告)号：US11823970B2

公开(公告)日：2023-11-21

申请号：US17308472

申请日：2021-05-05

Applicant: Infineon Technologies AG

Inventor： Bernhard Rieder ,  Thomas Kilger

IPC: H01L23/31 ,  H01L21/56 ,  H01Q1/22 ,  H01Q19/06 ,  H01L23/00

CPC classification number: H01L23/3135 ,  H01L21/56 ,  H01Q1/2283 ,  H01Q19/06 ,  H01L24/02 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/02379 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2924/10158

Abstract: A radar chip package includes a radar monolithic microwave integrated circuit (MMIC) having a backside, a frontside arranged opposite to the backside, and lateral sides that extend between the backside and the frontside, wherein the radar MIMIC comprises a recess that extends from the backside at least partially towards the frontside; a plurality of electrical interfaces coupled to the frontside of the radar MIMIC; at least one antenna arranged at the frontside of the radar MIMIC; and a lens formed over the recess and the at least one antenna, wherein the lens is coupled to the backside of the radar MMIC.

公开(公告)号：US11791542B2

公开(公告)日：2023-10-17

申请号：US16853995

申请日：2020-04-21

Applicant: Infineon Technologies AG

Inventor： Bernhard Rieder

IPC: H01Q1/32 ,  H01Q1/12 ,  G01S13/931 ,  G01S7/03

CPC classification number: H01Q1/3233 ,  G01S7/032 ,  G01S13/931 ,  H01Q1/1271 ,  G01S2013/93276

Abstract: A radio frequency (RF) device includes a conformal RF antenna configured to be mounted on a non-metallic component of a vehicle and configured to operate at frequencies greater than 10 GHz. The RF device further includes an RF chip mounted on the conformal RF antenna and electrically coupled to the conformal RF antenna to transfer an RF signal of a frequency greater than 10 GHz to the conformal RF antenna.

公开(公告)号：US11416730B2

公开(公告)日：2022-08-16

申请号：US16949155

申请日：2020-10-15

Applicant: Infineon Technologies AG

Inventor： Bernhard Rieder ,  Thomas Kilger

IPC: G06K19/077 ,  H01L23/66 ,  H01Q1/38 ,  H01Q1/22

Abstract: A radio-frequency device comprises a radio-frequency chip, a first connecting element arranged over a chip surface of the radio-frequency chip, the first connecting element being designed to mechanically and electrically connect the radio-frequency chip to a circuit board, and a radio-frequency signal carrying element arranged over the chip surface and electrically coupled to the radio-frequency chip, the radio-frequency signal carrying element being covered by an electrically nonconductive material and being designed to transmit a signal in a direction parallel to the chip surface, wherein the first connecting element and the radio-frequency signal carrying element are arranged at a same level in relation to a direction perpendicular to the chip surface, and wherein the first connecting element is spaced apart from the radio-frequency signal carrying element by way of a region that is free of the electrically nonconductive material.