Radio-frequency devices and associated production methods

    公开(公告)号:US11791529B2

    公开(公告)日:2023-10-17

    申请号:US17444864

    申请日:2021-08-11

    Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity.

    RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS

    公开(公告)号:US20210359387A1

    公开(公告)日:2021-11-18

    申请号:US17302468

    申请日:2021-05-04

    Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.

    RF devices including an RF chip having an electrical redistribution layer with RF antennas formed therein and methods of manufacture

    公开(公告)号:US11764453B2

    公开(公告)日:2023-09-19

    申请号:US17302468

    申请日:2021-05-04

    CPC classification number: H01P5/107 H01L23/66 H01P5/02 H01L2223/6627

    Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.

    COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

    公开(公告)号:US20240425363A1

    公开(公告)日:2024-12-26

    申请号:US18732102

    申请日:2024-06-03

    Inventor: Bernhard Rieder

    Abstract: A package includes a substrate having a first surface and an opposing second surface, a first cavity adjacent to the first surface of the substrate within the package, and a second cavity adjacent to the second surface of the substrate within the package, wherein the second cavity includes a fluid opening for allowing a fluid to enter the second cavity; a through hole in the substrate providing fluid communication between the first and second cavities; a MEMS sound transducer disposed in one of the first cavity or the second cavity; a MEMS pressure sensor disposed in the other one of the first cavity or the second cavity; and a discrete transfer block arranged on the substrate and configured to provide an electric path between the package pad and the MEMS sound transducer and the MEMS pressure sensor, wherein the transfer block is a discrete component separate from the substrate.

    Radio-frequency device with radio-frequency signal carrying element and associated production method

    公开(公告)号:US11416730B2

    公开(公告)日:2022-08-16

    申请号:US16949155

    申请日:2020-10-15

    Abstract: A radio-frequency device comprises a radio-frequency chip, a first connecting element arranged over a chip surface of the radio-frequency chip, the first connecting element being designed to mechanically and electrically connect the radio-frequency chip to a circuit board, and a radio-frequency signal carrying element arranged over the chip surface and electrically coupled to the radio-frequency chip, the radio-frequency signal carrying element being covered by an electrically nonconductive material and being designed to transmit a signal in a direction parallel to the chip surface, wherein the first connecting element and the radio-frequency signal carrying element are arranged at a same level in relation to a direction perpendicular to the chip surface, and wherein the first connecting element is spaced apart from the radio-frequency signal carrying element by way of a region that is free of the electrically nonconductive material.

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