公开(公告)号：US11854917B2

公开(公告)日：2023-12-26

申请号：US17248262

申请日：2021-01-15

Applicant: Infineon Technologies AG

Inventor： Ernst Seler ,  Ulrich Moeller ,  Bernhard Rieder

IPC: H01L23/10 ,  H01L23/66 ,  H01L23/053 ,  H01L23/498 ,  H01L23/24 ,  H01L21/48 ,  H01Q9/04

CPC classification number: H01L23/10 ,  H01L21/4803 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/24 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/66 ,  H01Q9/0407 ,  H01L2223/6677

Abstract: A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

公开(公告)号：US12248088B2

公开(公告)日：2025-03-11

申请号：US17541687

申请日：2021-12-03

Applicant: Infineon Technologies AG

Inventor： Rainer Findenig ,  Bernhard Greslehner-Nimmervoll ,  Grigory Itkin ,  Markus Josef Lang ,  Ulrich Moeller ,  Martin Wiessflecker

IPC: G01S7/35 ,  G01S13/02

Abstract: A radar semiconductor chip includes a radar circuit component configured to generate at least part of a frequency-modulated ramp signal or process at least part of a reflected frequency-modulated ramp signal according to a control parameter; a memory configured to store a sequencing program associated with regulating the control parameter, wherein the sequencing program specifies a first data source, external to the sequencing program, that is configured to provide a first data value corresponding to the control parameter; and a decoder configured to read the sequencing program, access the first data value from the first data source specified by the sequencing program, derive a first control value for the control parameter from the first data value, and provide the first control value to the radar circuit component. The radar circuit component regulates a controlled circuit function in accordance with the control parameter based on the first control value.

公开(公告)号：US09666543B2

公开(公告)日：2017-05-30

申请号：US14690025

申请日：2015-04-17

Applicant: Infineon Technologies AG

Inventor： Saverio Trotta ,  Jagjit Singh Bal ,  Ulrich Moeller ,  Andrzej Samulak ,  Werner Simbuerger

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/40

CPC classification number: H01L23/66 ,  H01L23/3675 ,  H01L23/40 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/16225

Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.

公开(公告)号：US20150305190A1

公开(公告)日：2015-10-22

申请号：US14690025

申请日：2015-04-17

Applicant: Infineon Technologies AG ,  Conti Temic microelectronic GmbH

Inventor： Saverio Trotta ,  Jagjit Singh Bal ,  Ulrich Moeller ,  Andrzej Samulak ,  Werner Simbuerger

IPC: H05K7/20 ,  H01L23/66 ,  H01L23/40 ,  H01L23/498 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L23/66 ,  H01L23/3675 ,  H01L23/40 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/16225

Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.

Abstract translation: 电子系统包括载体，该载体包括至少一个波导馈送，包括第一表面和第二表面的半导体芯片，以及集成RF电路，以及包括后向阻滞的冷却元件。 将半导体芯片安装到载体上使得第一表面面向载体。 集成RF电路连接到至少一个波导馈送。 冷却元件安装到载体上，使得后端与所述至少一个波导馈送的一端相邻，并且所述冷却元件至少部分地覆盖半导体芯片，使得半导体芯片的第二表面面向冷却元件。

公开(公告)号：US11824019B2

公开(公告)日：2023-11-21

申请号：US17356831

申请日：2021-06-24

Applicant: Infineon Technologies AG

Inventor： Tuncay Erdoel ,  Walter Hartner ,  Ulrich Moeller ,  Bernhard Rieder ,  Ernst Seler ,  Maciej Wojnowski

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01P3/12 ,  G01S13/02

CPC classification number: H01L23/66 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01P3/121 ,  H01Q1/2283 ,  G01S13/02 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

公开(公告)号：US11747437B2

公开(公告)日：2023-09-05

申请号：US16947605

申请日：2020-08-10

Applicant: Infineon Technologies AG

Inventor： Ernst Seler ,  Ulrich Moeller ,  Markus Treml

IPC: G01S7/35 ,  G01S13/34 ,  H03F1/00 ,  G01S13/02 ,  G01S13/931 ,  G01S7/03

CPC classification number: G01S7/35 ,  G01S13/34 ,  H03F1/00 ,  G01S7/03 ,  G01S7/032 ,  G01S7/034 ,  G01S13/02 ,  G01S13/931 ,  G01S2013/0254 ,  H03F2200/255

Abstract: The present disclosure relates to a radar transmitting device, comprising a CMOS transceiver chip configured to provide at least one local oscillator signal at an output of the CMOS transceiver chip, and at least one BiCMOS transmitter chip coupled to the CMOS transceiver chip. The BiCMOS transmitter chip has an input for the local oscillator signal, at least one amplifier coupled to the input, a plurality of outputs for outputting a radar transmission signal on the basis of the local oscillator signal, and a plurality of transmission paths between the input and the plurality of outputs. Each of the transmission paths has a controllable analog phase shifter for controllable beam scanning during emission of the radar transmission signal. Additionally or alternatively, individual transmission paths of the BiCMOS transmitter chip can be selectively activated or deactivated using control signals.