Invention Grant
- Patent Title: GAN-based, lateral-conduction, electronic device with improved metallic layers layout
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Application No.: US16676371Application Date: 2019-11-06
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Publication No.: US11854977B2Publication Date: 2023-12-26
- Inventor: Santo Alessandro Smerzi , Maria Concetta Nicotra , Ferdinando Iucolano
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: SEED INTELLECTUAL PROPERTY LAW GROUP LLP
- Priority: IT 2018000010195 2018.11.09
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L29/20 ; H01L29/417 ; H01L29/423

Abstract:
An electronic device, comprising plurality of source metal strips in a first metal level; a plurality of drain metal strips in the first metal level; a source metal bus in a second metal level above the first metal level; a drain metal bus, in the second metal level; a source pad, coupled to the source metal bus; and a drain pad, coupled to the drain metal bus. The source metal bus includes subregions shaped in such a way that, in top-plan view, each of them has a width which decreases moving away from the first conductive pad; the drain metal bus includes subregions shaped in such a way that, in top-plan view, each of them has a width which decreases moving away from the second conductive pad. The first and second subregions are interdigitated.
Public/Granted literature
- US20200152572A1 GAN-BASED, LATERAL-CONDUCTION, ELECTRONIC DEVICE WITH IMPROVED METALLIC LAYERS LAYOUT Public/Granted day:2020-05-14
Information query
IPC分类: