Invention Grant
- Patent Title: Semiconductor package substrate and semiconductor package including the same
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Application No.: US17167789Application Date: 2021-02-04
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Publication No.: US11854989B2Publication Date: 2023-12-26
- Inventor: Dongho Kim , Jongbo Shim , Hwan Pil Park , Choongbin Yim , Jungwoo Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20200078007 2020.06.25
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/13 ; H01L23/31 ; H01L23/00 ; H01L25/10 ; H01L25/065
Abstract:
A semiconductor package substrate includes a substrate having a bottom surface including a cavity structure defined therein. The cavity structure includes a floor surface. A passive device structure has at least a partial portion of the passive device structure disposed in the cavity structure. The passive device structure includes a first passive device and a second passive device that are each electrically connected to the floor surface of the cavity structure. At least partial portions of the first passive device and the second passive device vertically overlap each other.
Public/Granted literature
- US20210407923A1 SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2021-12-30
Information query
IPC分类:
