Invention Grant
- Patent Title: Quantum processors
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Application No.: US17681303Application Date: 2022-02-25
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Publication No.: US11856871B2Publication Date: 2023-12-26
- Inventor: Trevor M. Lanting , Danica W. Marsden , Byong Hyop Oh , Eric G. Ladizinsky , Shuiyuan Huang , J. Jason Yao , Douglas P. Stadtler
- Applicant: D-WAVE SYSTEMS INC.
- Applicant Address: CA Burnaby
- Assignee: D-WAVE SYSTEMS INC.
- Current Assignee: D-WAVE SYSTEMS INC.
- Current Assignee Address: CA Burnaby
- Agency: Cozen O'Connor
- Main IPC: H01L39/02
- IPC: H01L39/02 ; H10N60/80 ; G06N10/00 ; H10N60/12 ; H10N60/01 ; H10N69/00

Abstract:
Systems and methods for fabricating a superconducting integrated circuit that includes wiring layers comprising low-noise material are described. A superconducting integrated circuit can be implemented in a computing system that includes a quantum processor. Such a superconducting integrated circuit includes a first set of one or more wiring layers that form a noise-susceptible superconducting device that can decrease processor when exposed to noise. The superconducting integrated circuit can further include a second set of one or more wiring layers that form a superconducting device that is less susceptible to noise. Fabricating a superconducting device that contains low-noise material can include depositing and patterning a wiring layer comprising a first material that is superconductive in a respective range of temperatures and depositing and patterning a different wiring layer comprising a second material that is superconductive in a respective range of temperatures. The second material can be considered a low-noise material.
Public/Granted literature
- US20220263007A1 SYSTEMS AND METHODS FOR FABRICATING SUPERCONDUCTING INTEGRATED CIRCUITS Public/Granted day:2022-08-18
Information query
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