Invention Grant
- Patent Title: Probe module
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Application No.: US17608144Application Date: 2020-06-19
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Publication No.: US11860191B2Publication Date: 2024-01-02
- Inventor: Bin Jiang , Yue Liu , Hao Li
- Applicant: SUZHOU HYC TECHNOLOGY CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: SUZHOU HYC TECHNOLOGY CO., LTD.
- Current Assignee: SUZHOU HYC TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Suzhou
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 1911100838.7 2019.11.12 CN 1911100843.8 2019.11.12
- International Application: PCT/CN2020/097085 2020.06.19
- International Announcement: WO2021/093330A 2021.05.20
- Date entered country: 2021-11-01
- Main IPC: G01R1/07
- IPC: G01R1/07 ; G01R1/073

Abstract:
The present disclosure discloses a probe module, comprising: a body, a floating plate located at the bottom of the body and a probe assembly located on the side of the body which is far away from the floating plate. The probe assembly includes a cover plate, a mould core comprising pin grooves and blade pins each limited and fixed in the pin groove by a limiting member. The floating plate comprises pin holes, and the floating plate is configured to be floatable relative to the body in an extension direction of the blade pin and electrical contact terminals of the blade pins may be inserted into the pin holes from the surface of the floating plate close to the body and protrude from the surface of the floating plate which is far away from the body.
Public/Granted literature
- US20220229090A1 Probe Module Public/Granted day:2022-07-21
Information query