Invention Grant
- Patent Title: Access line having a resistive layer for memory cell access
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Application No.: US17460042Application Date: 2021-08-27
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Publication No.: US11862215B2Publication Date: 2024-01-02
- Inventor: Sateesh Talasila , Chandrasekhar Mandalapu , Robert Douglas Cassel , Sundaravadivel Rajarajan , Iniyan Soundappa Elango , Srivatsan Venkatesan
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Greenberg Traurig
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C13/00

Abstract:
Systems, methods, and apparatus related to spike current suppression in a memory array. In one approach, a memory device includes a memory array having a cross-point memory architecture. The memory array has access lines (e.g., word lines and/or bit lines) configured to access memory cells of the memory array. Each access line is formed of a conductive material (e.g., tungsten). The access line includes one or more resistive layers (e.g., tungsten silicon nitride) each having a resistivity greater than the resistivity of the conductive material used to form the access line. The resistive layers are formed overlying or underlying at least a portion of the memory cells. A driver is electrically connected to the access line using a via. The driver generates a voltage on the access line to access the memory cells.
Public/Granted literature
- US20230069190A1 Access Line Having a Resistive Layer for Memory Cell Access Public/Granted day:2023-03-02
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