Invention Grant
- Patent Title: Memory arrays
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Application No.: US17837879Application Date: 2022-06-10
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Publication No.: US11864386B2Publication Date: 2024-01-02
- Inventor: Sanh D. Tang , Richard J. Hill , Yi Fang Lee , Martin C. Roberts
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H10B51/00 ; H10B53/20 ; G06F3/06

Abstract:
A memory array comprises vertically-alternating tiers of insulative material and memory cells. The memory cells individually comprise a transistor comprising first and second source/drain regions having a channel region there-between and a gate operatively proximate the channel region. The individual memory cells comprise a capacitor comprising first and second electrodes having a capacitor insulator there-between. The first electrode electrically couples to the first source/drain region. Wordline structures extend elevationally through the insulative material and the memory cells of the vertically-alternating tiers. Individual of the gates that are in different of the memory cell tiers directly electrically couple to individual of the wordline structures. Sense-lines electrically couple to multiple of the second source/drain regions of individual of the transistors. Other embodiments are disclosed.
Public/Granted literature
- US20220320136A1 Memory Arrays Public/Granted day:2022-10-06
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