Invention Grant
- Patent Title: Semiconductor device and semiconductor memory device
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Application No.: US17690425Application Date: 2022-03-09
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Publication No.: US11871557B2Publication Date: 2024-01-09
- Inventor: Taro Shiokawa , Kiwamu Sakuma , Keiko Sakuma
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 21153487 2021.09.21
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H10B12/00 ; H01L29/786

Abstract:
A semiconductor device according to the embodiment includes: a first electrode; a second electrode; an oxide semiconductor layer provided between the first electrode and the second electrode; a gate electrode opposed to the oxide semiconductor layer; a gate insulating layer provided between the oxide semiconductor layer and the gate electrode; a first insulating layer provided between the gate electrode and the first electrode; and a second insulating layer provided between the gate electrode and the second electrode and having an oxygen atom concentration lower than an oxygen atom concentration of the first insulating layer.
Public/Granted literature
- US20230088455A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2023-03-23
Information query
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