Invention Grant
- Patent Title: Force sensing module with vibration feedback
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Application No.: US17752904Application Date: 2022-05-25
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Publication No.: US11874967B2Publication Date: 2024-01-16
- Inventor: Chin-Sung Liu , Shin-Ter Tsai , Hsiao-Ming Chien
- Applicant: TOPRAY MEMS INC.
- Applicant Address: TW Hsinchu
- Assignee: TOPRAY MEMS INC.
- Current Assignee: TOPRAY MEMS INC.
- Current Assignee Address: TW Hsinchu
- Agency: Lin & Associates Intellectual Property, Inc.
- Priority: TW 1114897 2022.04.19
- Main IPC: G06F3/01
- IPC: G06F3/01 ; G01L1/12

Abstract:
A force sensing module with vibration feedback is disclosed, comprising: a substrate, a frame and a plurality of magnetic sensors; the substrate is disposed with at least one tactile actuator, and the substrate has a touch operation surface and a mounting surface on opposite sides, the tactile actuator is mounted on the mounting surface; the frame is disposed with at least three buffer spacers, the buffer spacers connect the frame to the substrate; the magnetic sensor includes a magnet and a Hall element, one of the magnet and the Hall element is disposed on the frame, and the other is disposed on the substrate; thereby when a force is applied on the touch operation surface to make the substrate generate an offset, the Hall element outputs a force signal due to the voltage change caused by the approaching magnet, and the signal drives the tactile actuator to generate a vibration feedback.
Public/Granted literature
- US20230333656A1 FORCE SENSING MODULE WITH VIBRATION FEEDBACK Public/Granted day:2023-10-19
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