- 专利标题： Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same
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申请号： US16009226申请日： 2018-06-15
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公开(公告)号： US11878388B2公开(公告)日： 2024-01-23
- 发明人: Kuan-Cheng Wang , Ching-Hua Hsieh , Yi-Yang Lei
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： B24B37/26
- IPC分类号： B24B37/26 ; B24B37/16 ; B24D11/04 ; B24B37/22 ; B24B37/24 ; B24B7/22 ; H01L21/321 ; H01L23/00 ; H01L21/48 ; H01L21/687 ; B24D13/14
摘要：
A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.
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