- 专利标题: Photonics chips with reticle stitching by back-to-back tapered sections
-
申请号: US17847399申请日: 2022-06-23
-
公开(公告)号: US11880066B2公开(公告)日: 2024-01-23
- 发明人: Kevin Dezfulian , Yusheng Bian
- 申请人: GlobalFoundries U.S. Inc.
- 申请人地址: US NY Malta
- 专利权人: GlobalFoundries U.S. Inc.
- 当前专利权人: GlobalFoundries U.S. Inc.
- 当前专利权人地址: US NY Malta
- 代理机构: Thompson Hine LLP
- 代理商 Anthony Canale
- 主分类号: G02B6/122
- IPC分类号: G02B6/122 ; G02B6/12
摘要:
Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a second chip region, a first waveguide core in the first chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned across the boundary from the first tapered section. The first tapered section has a first width dimension that increases with increasing distance from the boundary, and the second tapered section has a second width dimension that increases with increasing distance from the boundary.
公开/授权文献
信息查询