Invention Grant
- Patent Title: Photonics chips with reticle stitching by back-to-back tapered sections
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Application No.: US17847399Application Date: 2022-06-23
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Publication No.: US11880066B2Publication Date: 2024-01-23
- Inventor: Kevin Dezfulian , Yusheng Bian
- Applicant: GlobalFoundries U.S. Inc.
- Applicant Address: US NY Malta
- Assignee: GlobalFoundries U.S. Inc.
- Current Assignee: GlobalFoundries U.S. Inc.
- Current Assignee Address: US NY Malta
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/12

Abstract:
Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a second chip region, a first waveguide core in the first chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned across the boundary from the first tapered section. The first tapered section has a first width dimension that increases with increasing distance from the boundary, and the second tapered section has a second width dimension that increases with increasing distance from the boundary.
Public/Granted literature
- US20230417990A1 PHOTONICS CHIPS WITH RETICLE STITCHING BY BACK-TO-BACK TAPERED SECTIONS Public/Granted day:2023-12-28
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