Invention Grant
- Patent Title: Method for manufacturing electronic chips
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Application No.: US18153929Application Date: 2023-01-12
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Publication No.: US11881413B2Publication Date: 2024-01-23
- Inventor: Michael De Cruz , Olivier Ory
- Applicant: STMICROELECTRONICS (TOURS) SAS
- Applicant Address: FR Tours
- Assignee: STMICROELECTRONICS (TOURS) SAS
- Current Assignee: STMICROELECTRONICS (TOURS) SAS
- Current Assignee Address: FR Tours
- Agency: Seed IP Law Group LLP
- Priority: FR 13744 2019.12.04
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/48 ; H01L21/56

Abstract:
A method for manufacturing electronic chips includes forming, on the side of a first face of a semiconductor substrate, in and on which a plurality of integrated circuits has been formed beforehand, metallizations coupling contacts of adjacent integrated circuits to one another. The method further includes forming, on the side of the first face of the substrate, first trenches extending through the first face of the substrate and laterally separating the adjacent integrated circuits. The first trenches extend through the metallizations to form at least a portion of metallizations at each of the adjacent circuits.
Public/Granted literature
- US20230178380A1 METHOD FOR MANUFACTURING ELECTRONIC CHIPS Public/Granted day:2023-06-08
Information query
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