Invention Grant
- Patent Title: Ceramic semiconductor package seal rings
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Application No.: US18172208Application Date: 2023-02-21
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Publication No.: US11881460B2Publication Date: 2024-01-23
- Inventor: Yiqi Tang , Li Jiang , Rajen Manicon Murugan
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- The original application number of the division: US17335010 2021.05.31
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/552 ; H01L23/58 ; H01L21/50 ; H01L21/52

Abstract:
In examples, a semiconductor package comprises a ceramic substrate and first and second metal layers covered by the ceramic substrate. The first metal layer is configured to carry signals at least in a 20 GHz to 28 GHz frequency range. The package comprises a semiconductor die positioned above the first and second metal layers and coupled to the first metal layer. The package comprises a ground shield positioned in a horizontal plane between the semiconductor die and the first metal layer, the ground shield including an orifice above a portion of the first metal layer. The package includes a metal seal ring coupled to a top surface of the ceramic substrate, the metal seal ring having a segment that is vertically aligned with a segment of the ground shield. The segment of the ground shield is between the orifice of the ground shield and a horizontal center of the ground shield. The package comprises a metal lid coupled to a top surface of the metal seal ring.
Public/Granted literature
- US20230197642A1 CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS Public/Granted day:2023-06-22
Information query
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